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Backside preparation and failure analysis for packaged microelectromechanical systems (MEMS)

Author(s):
Walraven, J.A. ( Sandia National Labs. (USA) )
Cole, E.l. ( Sandia National Labs. (USA) )
Barr, Jr.D.L. ( Sandia National Labs. (USA) )
Anderson, R.E. ( Sandia National Labs. (USA) )
Kilgo, A. ( Sandia National Labs. (USA) )
Maciel, J.J. ( Radant MEMS, Inc. (USA) )
Morrison, R. ( Radant MEMS, Inc. (USA) )
Karabudak, N.N. ( Lockheed Martin Space Systems (USA) )
3 more
Publication title:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5716
Pub. Year:
2005
Page(from):
165
Page(to):
172
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456908 [081945690X]
Language:
English
Call no.:
P63600/5716
Type:
Conference Proceedings

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