Heat damage-free laser-microjet cutting achieves highest die fracture strength

Heat damage-free laser-microjet cutting achieves highest die fracture strength

Author(s):

Perrottet, D. ( Synova SA (Switzerland) )
Housh, R. ( Synova SA (Switzerland) )
Richerzhagen, B. ( Synova SA (Switzerland) )
Manley, J. ( Synova-USA Inc. (USA) )

Publication title:

Photon Processing in Microelectronics and Photonics IV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5713

Pub. Year:

2005

Page(from):

285

Page(to):

292

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819456878 [081945687X]

Language:

English

Call no.:

P63600/5713

Type:

Conference Proceedings

Details

TDL ID:	ZA00014930
Series ID:	PA00000029
Conf. info. (Name):	SPIE LASE : Photon processing in microelectronics and photonics
Conf. info. (Number):	2005 : 4th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2005.01.24-2005.01.27

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