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90-nm dual damascene patterning with a new via fill material

Author(s):
Chen, C. J. ( Semiconductor Manufacturing International Corp. (China) )
Gao, X. Y. ( Semiconductor Manufacturing International Corp. (China) )
Lin, Y. S. ( Semiconductor Manufacturing International Corp. (China) )
Cheng, L. H. ( Semiconductor Manufacturing International Corp. (China) )
Kuo, C. C ( Semiconductor Manufacturing International Corp. (China) )
Xing, G. Q. ( Semiconductor Manufacturing International Corp. (China) )
Zhou, D.-L. ( Honeywell International Inc. (USA) )
Muramatsu, M. ( Tokyo Electron Ltd. (Japan) )
Nakashima, M. ( Tokyo Electron Ltd. (Japan) )
4 more
Publication title:
Advanced microlithography technologies : 8-10 November, 2004, Beijing, China
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5645
Pub. Year:
2004
Page(from):
339
Page(to):
352
Pages:
14
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456007 [0819456004]
Language:
English
Call no.:
P63600/5645
Type:
Conference Proceedings

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