Increasing post OPC layout verification coverage using a full-chip simulation based verification method
- Author(s):
- Hung, C.-Y. ( Semiconductor Manufacturing International Corp. (China) )
- Wang, Y. D. ( Synopsys, Inc. (China) )
- Deng, Z. X. ( Semiconductor Manufacturing International Corp. (China) )
- Gao, G. S. ( Semiconductor Manufacturing International Corp. (China) )
- Fan, M. H. ( Synopsys, Inc. (USA) )
- Publication title:
- Advanced microlithography technologies : 8-10 November, 2004, Beijing, China
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5645
- Pub. Year:
- 2004
- Page(from):
- 315
- Page(to):
- 319
- Pages:
- 5
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819456007 [0819456004]
- Language:
- English
- Call no.:
- P63600/5645
- Type:
- Conference Proceedings
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