Blank Cover Image

Methodology for a sub-90nm contact layer OPC with DEM flow demonstration

Author(s):
  • Hung, C.-Y. ( Semiconductor Manufacturing International Corp. (China) )
  • Zhang, B. ( Semiconductor Manufacturing International Corp. (China) )
  • Zhang, J. ( Semiconductor Manufacturing International Corp. (China) )
  • Xing, G. Q. ( Semiconductor Manufacturing International Corp. (China) )
Publication title:
Advanced microlithography technologies : 8-10 November, 2004, Beijing, China
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5645
Pub. Year:
2004
Page(from):
14
Page(to):
20
Pages:
7
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819456007 [0819456004]
Language:
English
Call no.:
P63600/5645
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Lithography process related OPC development and verification demonstration on a sub-9Onm poly layer [5853-52]

Hung, C.-Y., Liu, Q., Zhang, L., Shang, S., Jost, A.

SPIE - The International Society of Optical Engineering
7 Conference Proceedings 90-nm dual damascene patterning with a new via fill material

Chen, C. J., Gao, X. Y., Lin, Y. S., Cheng, L. H., Kuo, C. C, Xing, G. Q., Zhou, D.-L., Muramatsu, M., Nakashima, M.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Formation and verification of a 90-nm contact lumped model

Hung, C. -Y., Zhang, B., Wang, Y. D.

SPIE - The International Society of Optical Engineering
8 Conference Proceedings Experimental methodology of contact edge roughness on sub-100-nm pattern

Lee, T.Y., Ihm, D., Kang, H.C., Lee, J.B., Lee, B.-H., Chin, S.-B., Cho, D.-H., Kim, Y.H., Yang, H.D., Yang, K.M.

SPIE - The International Society of Optical Engineering
3 Conference Proceedings OPC accuracy and process window verification methodology for sub-100-nm node

Yang, H., Park, C., Hong, J., Jeong, G., Cho, B., Choi, J., Kang, C., Yang, K., Kang, E., Ji, S., Yim, D., Song, Y.

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Model based SRAF insertion check with OPC verify tools [6283-73]

Hung, -Y. C., Deng, Z., Gao, G., Zhang, l., Liu, Q.

SPIE - The International Society of Optical Engineering
4 Conference Proceedings A methodology to weight OPC modeling data plans [6283-72]

Hung, -Y. C., Wang, -H. C., Liu, Q., Ma, C., Wu, K., Zhang, G.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings A Novel Approach to Contact Integration at 90-nm and Beyond

Singhal, A., Sparks, T., Strozewski, K., Huang, F., Parihar, S., Schmidt, J., Boeck, B., Fretwell, J., Veap, G., Sheth, …

Electrochemical Society
5 Conference Proceedings A methodology to take LER effect into OPC modeling algorithm [6154-125]

Hung, C. Y., Liu, Q., Deng, Z., Zhang, L.

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Solutions for printing sub-100-nm contacts with ArF

Graeupner, P., Goehnermeier, A., Lowisch, M., Garreis, R.B., Flagello,D.G., Hansen, S.G., Socha, R.J., Koehler, C.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings CD uniformity improvement of sub 60nm contact hole using model based OPC

H.-S. Yune, Y.-B. Ahn, J.-C. Kim, H.-J. Shin, G. Yoo

Society of Photo-optical Instrumentation Engineers
12 Conference Proceedings New process models for OPC at sub-90-nm nodes

Granik, Y., Cobb, N.B.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12