Effect of thermal loading on the deformations of the optoelectronic package: a moire interferometry approach

Effect of thermal loading on the deformations of the optoelectronic package: a moire interferometry approach

Author(s):: Voloshin, A. S. ( Lehigh Univ. (USA) )
Publication title:: Active and passive optical components for WDM communications IV : 25-28 October, 2004, Philadelphia, Pennsylvania, USA
Title of ser.:: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:: 5595
Pub. Year:: 2004
Page(from):: 428
Page(to):: 438
Pages:: 11
Pub. info.:: Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:: 0277786X
ISBN:: 9780819455482 [0819455482]
Language:: English
Call no.:: P63600/5595
Type:: Conference Proceedings

Details

TDL ID:	ZA00014801
Series ID:	PA00000029
Conf. info. (Name):	Optics East : Active and passive optical components for WDM communications
Conf. info. (Number):	2004 : 4th
Conf. info. (Venue):	Philadelphia, PA, USA
Conf. info. (Date):	2004.10.25-2004.10.28

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