Measurement results on after-etch resist coated features on the new Leica Microsystems' LWM270 DUV critical dimension metrology system

Measurement results on after-etch resist coated features on the new Leica Microsystems' LWM270 DUV critical dimension metrology system

Author(s):

Whittey, J. M. ( Leica Microsystems, Inc. (USA) )
Steinberg, W. ( Leica Microsystems GmbH(Germany) )

Publication title:

20th European Conference on Mask Technology for Integrated Circuits and Microcomponents

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5504

Pub. Year:

2004

Page(from):

19

Page(to):

25

Pages:

7

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819454379 [0819454370]

Language:

English

Call no.:

P63600/5504

Type:

Conference Proceedings

Details

TDL ID:	ZA00014705
Series ID:	PA00000029
Conf. info. (Name):	European Mask and Lithography Conference : European Conference on Mask Technology for Integrated Circuits and Microcomponents
Conf. info. (Number):	2004 : 20th
Conf. info. (Venue):	Dresden, Germany
Conf. info. (Date):	2004.01.12-2004.01.14

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