Bondability of processed glass wafers

Bondability of processed glass wafers

Author(s):

Pandraud, G. ( Univ. of Twente (Netherlands) )
Gui, C. ( Univ. of Twente (Netherlands) )
Pigeon, F. ( Univ. Jean Monnet (France) )
Lambeck, P. V. ( Univ of Twente (Netherlands) )
Parriaux, O. M. ( Univ. Jean Monnet (France) )

Publication title:

Microsystems Metrology and Inspection

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3825

Pub. Year:

1999

Page(from):

53

Page(to):

62

Pages:

10

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819433114 [081943311X]

Language:

English

Call no.:

P63600/3825

Type:

Conference Proceedings

Details

TDL ID:	ZA00014625
Series ID:	PA00000029
Conf. info. (Name):	Industrial Lasers and Inspection : Microsystems metrology and inspection
Conf. info. (Number):	1999
Conf. info. (Venue):	Munich, Germany
Conf. info. (Date):	1999.06.15-1999.06.16

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