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The Simulation Of Copper Drift in SiO2 During Bias Temperature Stress (Bts) Test

Author(s):
Publication title:
Modeling and numerical simulation of materials behavior and evolution : symposium held April 2-5, 2002, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
731
Pub. Year:
2002
Page(from):
129
Page(to):
268
Pages:
146
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558996670 [1558996672]
Language:
English
Call no.:
M23500/731
Type:
Conference Proceedings

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