Thin Film Fracture During Nanoindentation of Hard Film-Soft Substrate Systems

Thin Film Fracture During Nanoindentation of Hard Film-Soft Substrate Systems

Author(s):

Publication title:

Thin films : stresses and mechanical properties IX : symposium held November 26-30, 2001, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

695

Pub. Year:

2002

Page(from):

317

Page(to):

322

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558996311 [1558996311]

Language:

English

Call no.:

M23500/695

Type:

Conference Proceedings

Details

TDL ID:	ZA00014570
Series ID:	PA00000011
Conf. info. (Name):	Symposium on thin films
Conf. info. (Number):	9th
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2001.11.26-2001.11.30

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