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Dislocation Networks Strain Fields Induced by Si Wafer Bonding

Author(s):
Eymery, J.
Fournel, F.
Rousseau, K.
Buttard, D.
Leroy, F.
Rieutord, F.
Rouviere, J.L.
2 more
Publication title:
Dislocations and deformation mechanisms in thin films and small structures : symposium held April 17-19, 2001, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
673
Pub. Year:
2001
Pages:
6
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558996090 [1558996095]
Language:
English
Call no.:
M23500/673
Type:
Conference Proceedings

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