Blank Cover Image

Fixed Abrasive Technology for STI CMP on a Web Format Tool

Author(s):
Publication title:
Chemical-mechanical polishing 2001 -- advances and future challenges : symposium held April 18-20, 2001, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
671
Pub. Year:
2001
Pages:
9
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558996076 [1558996079]
Language:
English
Call no.:
M23500/671
Type:
Conference Proceedings

Similar Items:

7 Conference Proceedings A Dishing Model for STI CMP Process

Chang, Shih-Hsiang

Materials Research Society

Y. Matsui, Y. Tateyama, K. Iwade, T. Nishioka, H. Yano

Electrochemical Society

Tunick, Allen A., Chen, Jamin

American Institute of Chemical Engineers

Evans, David R., Oliver, Michael R., Kidus, Mike

Electrochemical Society

Kulawski, Martin, Henttinen, Kimmo, Suni, Ilkka, Weimar, Frauke, Makinen, Jari

Materials Research Society

Kulawski, Martin, Luoto, Hannu, Henttinen, Kimmo, Suni, Tommi, Weimar, Frauke, Makinen, Jari

Materials Research Society

Kulawski, Martin, Luoto, Hannu, Henttinen, Kimmo, Suni, Ilkka, Weimar, Franke, Makinen, Jari

Materials Research Society

Hansen, D.A., Wu, C., Lu, H.B., Oyumi, M., Velidandla, V.

Electrochemical Society

Alexander M. Gouskov, Sergey A. Voronov, Stephen A. Batzer

American Society of Mechanical Engineers

B.H. Lv, J.L. Yuan, Y.X. Yao, Z.W. Wang

Trans Tech Publications

12 Conference Proceedings Abrasive Contribution to CMP Friction

Evans, David R., Oliver, Michael R.

Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12