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A Predictive Model for Controlling Wafer Level Polish Rate Uniformity in Oxide CMP

Author(s):
Publication title:
Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
867
Pub. Year:
2005
Page(from):
241
Page(to):
246
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998209 [1558998209]
Language:
English
Call no.:
M23500/867
Type:
Conference Proceedings

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