The Effect of Pad Conditioning on Planarization Characteristics of Chemical Mechanical Polishing (CMP) with Ceria Slurry

The Effect of Pad Conditioning on Planarization Characteristics of Chemical Mechanical Polishing (CMP) with Ceria Slurry

Author(s):

YYamamoto, uichi

Publication title:

Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

867

Pub. Year:

2005

Page(from):

117

Page(to):

122

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558998209 [1558998209]

Language:

English

Call no.:

M23500/867

Type:

Conference Proceedings

Details

TDL ID:	ZA00014510
Series ID:	PA00000011
Conf. info. (Name):	MRS Spring Meeting
Conf. info. (Number):	2005
Conf. info. (Venue):	San Francisco, California, U.S.A.
Conf. info. (Date):	2005.03.28-2005.03.31

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