Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates
- Author(s):
Kulawski, Martin Luoto, Hannu Henttinen, Kimmo Suni, Tommi Weimar, Frauke Makinen, Jari - Publication title:
- Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 867
- Pub. Year:
- 2005
- Page(from):
- 111
- Page(to):
- 116
- Pages:
- 6
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558998209 [1558998209]
- Language:
- English
- Call no.:
- M23500/867
- Type:
- Conference Proceedings
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