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Advanced Al Damascene Process for Fine Trench under 70nm Design Rule

Author(s):
Han, Sung Ho
Choi, Kyung-in
Yun, Sera
Park, Jeong Heon
Lee, Won Sok
Lee, Sang Woo
Choi, Gil Heyun
Hong, Change Kee
Kim, Sung Tae
Chung, Uin
Moon, Joo Tae
Ryu, Byung-Il
7 more
Publication title:
Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
863
Pub. Year:
2005
Page(from):
233
Page(to):
240
Pages:
8
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998162 [1558998160]
Language:
English
Call no.:
M23500/863
Type:
Conference Proceedings

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