Blank Cover Image

A Novel Copper Damascene Technique for Power Loaded SAW Structures

Author(s):
Menzel, S. B.
Albert, M.
Reitz, D.
Wendrock, H.
Schmidt, H.
Weihnacht, M.
Wetzig, K.
Bartha, J. W.
3 more
Publication title:
Materials, integration and packaging issues for high-frequency devices
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
833
Pub. Year:
2004
Page(from):
129
Page(to):
134
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997813 [1558997814]
Language:
English
Call no.:
M23500/833
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings In Situ Electromigration Damage of Al Interconnect Lines and the Influence of Grain Orientation

Buerke, A., Wendrock, H., Kotter, T., Menzel, S., Wetzig, K., Glasow, A. von

MRS - Materials Research Society
7 Conference Proceedings A Novel Spin-Etch Planarization Process for Dual-Damascene Copper Interconnects

Levert, J., Mukherjee, S., DeBear, D., Fury, M.

Electrochemical Society
2 Conference Proceedings Effect of Interfaces on Fiber Fracture in Mg and MgLi Matrix Composites

Kudela, S., Wendrock, H., Kudela, S. Jr., Ptacek, L., Menzel, S., Wetzig, K.

Trans Tech Publications
8 Conference Proceedings Electroplated Damascene Copper: Process Influences on Recrystallization and Texture

Gross, M. E., Drese, R., Lingk, C., Brown, W. L., Evans-Lutterodt, K., Barr, D., Golovin, D., Ritzdorf, T., Turner, J., …

MRS - Materials Research Society
3 Conference Proceedings Hafnium oxide for optical applications deposited by different CMOS compatible methods [5870-21]

Albert, M., Rotler, T., Adolphi, B., Bartha, J W.., Gruger, H., Kunath, C., Sarge, S.

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Electroplated Damascene Copper: Process Influences on Recrystallization and Texture

Barr, D., Brown, W. L., Drese, R., Evans-Lutterodt, K., Golovin, D., Graham, L., Gross, M. E., Lingk, C., Ritzdorf, T., …

Materials Research Society
4 Conference Proceedings Challenges of damascene etching for copper interconnect

Ho,P.K.K., Zhou,M.-S., Gupta,S., Chockalingam,R., Li,J.-X., Fan,M.-H.

SPIE - The International Society for Optical Engineering
10 Conference Proceedings Novel antireflective structure for metal layer patterning

Choi,S.-S., Cha,H.S., Kim,J.-S., Park,J.M., Kim,D.H., Lee,K.H., Ahn,J., Chung,H.B., Kim,B.W.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Microstructure and Texture of Electroplated Copper in Damascene Structures

Gross, M. E., Lingk, C., Siegrist, T., Coleman, E., Brown, W. L., Ueno, K., Tsuchiya, Y., Itoh, N., Ritzdorf, T., …

MRS - Materials Research Society
11 Conference Proceedings Length Effects On The Reliability Of Dual-Damascene Cu Interconnects

Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., …

Materials Research Society
6 Conference Proceedings Microtexture Measurement of Copper Damascene Line with EBSD

Kim, D.-I., Paik, J.-M., Joo, Y.-C., Oh, K.H., Lee, H.-C., Dicks, K.

Trans Tech Publications
12 Conference Proceedings Crystallographic Texture And Phase Metrology During Damascene Copper Processing

Kozaczek, K.J., DeHaven, P.W., Rodbell, K.P., Malhotra, S., Kurtz, D.S., Martin, R.I., Moran, P.R.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12