Residual Stress in Silicon Nitride Thin Films Deposited by ECR-PECVD

Residual Stress in Silicon Nitride Thin Films Deposited by ECR-PECVD

Author(s):

Publication title:

Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

795

Pub. Year:

2002

Page(from):

515

Page(to):

520

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997332 [1558997334]

Language:

English

Call no.:

M23500/795

Type:

Conference Proceedings

Details

TDL ID:	ZA00014467
Series ID:	PA00000011
Conf. info. (Name):	Symposium on thin films
Conf. info. (Number):	10th
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2003.12.01-2003.12.05

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