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Understanding Adhesion Failure in Low-k Dielectric Stack During Chemical-Mechanical Polishing

Author(s):
Publication title:
Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
795
Pub. Year:
2002
Page(from):
131
Page(to):
136
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997332 [1558997334]
Language:
English
Call no.:
M23500/795
Type:
Conference Proceedings

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