The Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film

The Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film

Author(s):

Publication title:

Thin films : stresses and mechanical properties X : symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

795

Pub. Year:

2002

Page(from):

87

Page(to):

92

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997332 [1558997334]

Language:

English

Call no.:

M23500/795

Type:

Conference Proceedings

Details

TDL ID:	ZA00014467
Series ID:	PA00000011
Conf. info. (Name):	Symposium on thin films
Conf. info. (Number):	10th
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2003.12.01-2003.12.05

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