Influence of Electrochemical Plating Process Parameters on Corrosion of Cu Damascene Interconnects

Influence of Electrochemical Plating Process Parameters on Corrosion of Cu Damascene Interconnects

Author(s):

Publication title:

Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

816

Pub. Year:

2004

Page(from):

183

Page(to):

190

Pages:

8

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997660 [1558997660]

Language:

English

Call no.:

M23500/816

Type:

Conference Proceedings

Details

TDL ID:	ZA00014458
Series ID:	PA00000011
Conf. info. (Name):	Symposium on advances in chemical-mechanical polishing
Conf. info. (Number):	2004
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2004.04.13-2004.04.15

Similar Items:

1 Conference Proceedings Inhibition of Galvanic Corrosion of Wnc Barrier Metal for Reliable Cu Cmp D. Ernur, V. Terzieva, J. Schuhmacher, K. Maex American Institute of Chemical Engineers	7 Conference Proceedings Effect of Cu on Al Interfacial Mass Transport in Bamboo RIE and Damascene Al(Cu) Proost, J., Li, H., Witvrouw, A., Maex, K. MRS - Materials Research Society
2 Conference Proceedings Copper Deposition and Subsequent Grain Structure Evolution in Narrow Lines Brongersma, S.H., D'Haen, J., Vanstreels, K., DeCeuninck, W., Vervoort, I., Maex, K. Trans Tech Publications	8 Conference Proceedings New Interpretation of the Influence of Various Parameters on Texture Evolution in Damascene Cu Interconnect Lines Mirpuri, K. K., Szpunar, J. A. Trans Tech Publications
3 Conference Proceedings Integration of Electroless and Electrolytic Cu in the IC Back End of Line Technologies* Maex, K., Brongersma, S.H., Lantasov, Y., Richard, E., Palmans, R., Vervoort, I. Electrochemical Society	9 Conference Proceedings Zeolite Low-k Film Properties Dependence on Nanocrystal Size Eslava-Fernandez, Salvador, Baklanov, M. R., Iacopi, F., Brongersma, S.H., Kirschhock, C.E.A., Maex, K. Materials Research Society
4 Conference Proceedings Length Effects On The Reliability Of Dual-Damascene Cu Interconnects Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., … Materials Research Society	10 Conference Proceedings A Quantitative Study Of The Adhesion Between Copper, Barrier And Organic Low-k Materials Lanckmans, F., Brongersma, S., Varga, I., Bender, H., Beyne, E., Maex, K. Materials Research Society
5 Conference Proceedings Buckling Instabilities of Thin Cap Layers Deposited Onto Low-k Dielectric Films Iacopi, F., Brongersma, S.H., Abell, T.J., Maex, K. Materials Research Society	11 Conference Proceedings Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects Choi, Z.-S., Gan, C.L., Wei, F., Thompson, C.V., Lee, J.H., Pey, K.L., Choi, W.K. Materials Research Society
6 Conference Proceedings Cross-Section Nano-Indentation for Rapid Adhesion Evaluation Brongersma, S.H., Degryse, Dominiek, Souiller, Jerome, Vandevelde, Bart, Maex, K. Materials Research Society	12 Conference Proceedings PLANARIZED COPPER INTERCONNECTS BY SELECTIVE ELECTROLESS PLATING Kiang, M. H., Tao, J.,, Namgoong, W., Hu, C, Lieberman, M., Cheung, N. W., Kang, H.-K., Wong. S. S. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12