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Coupling Between Precipitation and Plastic Deformation During Electromigration in a Passivated Al (0.5wt%Cu) Interconnect

Author(s):
Barabash, R.I.
Ice, G.E.
Tamura, N.
Valek, B.C.
Spolenak, R.
Bravman, J.C.
Patel, J.R.
2 more
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics - 2004 : symposium held April 13-15, 2004, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
812
Pub. Year:
2004
Page(from):
351
Page(to):
360
Pages:
10
Pub. info.:
Warrendale: Materials Research Society
ISSN:
02729172
ISBN:
9781558997622 [1558997628]
Language:
English
Call no.:
M23500/812
Type:
Conference Proceedings

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