Integration of III-V Optoelectronic Components on Si Platform

Integration of III-V Optoelectronic Components on Si Platform

Author(s):

Publication title:

Materials, integration and packaging issues for high-frequency devices

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

783

Pub. Year:

2004

Page(from):

217

Page(to):

222

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997219 [1558997210]

Language:

English

Call no.:

M23500/783

Type:

Conference Proceedings

Details

TDL ID:	ZA00014440
Series ID:	PA00000011
Conf. info. (Name):	Materials, Integration and Packaging Issues for High-Frequency Devices : Symposium
Conf. info. (Number):	2nd
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2004.11.29-2004.12.01

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