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Rapid Prototype Fabrication of Custom Chip Scale Packages

Author(s):
Publication title:
Materials, integration and packaging issues for high-frequency devices
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
783
Pub. Year:
2004
Page(from):
185
Page(to):
190
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997219 [1558997210]
Language:
English
Call no.:
M23500/783
Type:
Conference Proceedings

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