High-Q Integrated RF Passives and RF-MEMS on Silicon
- Author(s):
- Publication title:
- Materials, integration and packaging issues for high-frequency devices
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 783
- Pub. Year:
- 2004
- Page(from):
- 97
- Page(to):
- 108
- Pages:
- 12
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558997219 [1558997210]
- Language:
- English
- Call no.:
- M23500/783
- Type:
- Conference Proceedings
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