Chemical-Mechanical Planarization of Copper: The Effect of Inhibitor and Complexing Agent
- Author(s):
- Publication title:
- Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 767
- Pub. Year:
- 2003
- Page(from):
- 297
- Page(to):
- 304
- Pages:
- 8
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558997042 [1558997040]
- Language:
- English
- Call no.:
- M23500/767
- Type:
- Conference Proceedings
Similar Items:
Materials Research Society |
7
Conference Proceedings
Chemical-mechanical Planarization of Copper: Role of Oxidants and Inhibitors
Electrochemical Society |
2
Conference Proceedings
Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine and Cu Sulfate
Materials Research Society |
8
Conference Proceedings
Selectivity Studies on Tantalum Barrier Layer for Copper Chemical Mechanical Planarization
Electrochemical Society |
Electrochemical Society |
MRS - Materials Research Society |
4
Conference Proceedings
The Application of Chemical Mechanical Polishing for Nickel Used in MEMS Devices
Materials Research Society |
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
6
Conference Proceedings
Role of Oxidizer and Inhibitor on Chemical Mechanical Planarization of Copper
Electrochemical Society |
Materials Research Society |