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Selectivity Studies on Tantalum Barrier Layer in Copper CMP

Author(s):
Publication title:
Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
767
Pub. Year:
2003
Page(from):
251
Page(to):
256
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997042 [1558997040]
Language:
English
Call no.:
M23500/767
Type:
Conference Proceedings

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