A Novel CMP Process on Fixed Abrasive Pads for the Manufacturing of Highly Planar Thick Film SOI Substrates
- Author(s):
- Publication title:
- Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 767
- Pub. Year:
- 2003
- Page(from):
- 133
- Page(to):
- 140
- Pages:
- 8
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558997042 [1558997040]
- Language:
- English
- Call no.:
- M23500/767
- Type:
- Conference Proceedings
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