Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Author(s):

Publication title:

Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

767

Pub. Year:

2003

Page(from):

21

Page(to):

26

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997042 [1558997040]

Language:

English

Call no.:

M23500/767

Type:

Conference Proceedings

Details

TDL ID:	ZA00014425
Series ID:	PA00000011
Conf. info. (Name):	Symposium on chemical-mechanical planarization
Conf. info. (Number):	2003
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2003.04.22-2003.04.24

Similar Items:

1 Conference Proceedings Dispersion Number Studies in Chemical Mechanical Planarization Philipossian, Ara, Mitchell, Erin Materials Research Society	7 Conference Proceedings Effect of Pad Surface Texture and Slurry Abrasive Concentration on Tribological and Kinetic Attributes of ILD CMP Philipossian, Ara, Olsen, Scott Materials Research Society
2 Conference Proceedings The Effect of Wafer Shape on Slurry Film Thickness and Friction Coefficients in Chemical Mechanical Planarization Lu, Joseph, Coppeta, Jonathan, Rogers, Chris, Manno, Vincent P., Racz, Livia, Philipossian, Ara, Moinpour, Mansour, … Materials Research Society	8 Conference Proceedings A Technique for Measuring Slurry-Flow Dynamics During Chemical Mechanical Polishing Coppeta, J., Rogers, C., Philipossian, A., Kaufman, F. MRS - Materials Research Society
3 Conference Proceedings In Situ Temperature Measurement During Oxide Chemical Mechanical Planarization Cornely, Jesse, Rogers, Chris, Manno, Vincent, Philipossian, Ara Materials Research Society	9 Conference Proceedings Pad Topography, Contact Area and Hydrodynamic Lubrication in Chemical-Mechanical Polishing Leonard John Borucki, Ting Sun, Yun Zhuang, David Slutz, Ara Philipossian Materials Research Society
4 Conference Proceedings Instantaneous Fluid Film Imaging in Chemical Mechanical Planarization Apone, Daniel, Gray, Caprice, Rogers, Chris, Manno, Vincent P., Barns, Chris, Moinpour, Mansour, Anjur, Sriram, … Materials Research Society	10 Conference Proceedings Screening Study on Frictional Force Analysis in Relation to Silica Abrasive and Slurry Properties Yun Zhuang, Yasa Adi Sampurno, Fransisca Sudargho, Geoff Steward, Herbert Barthel, Erwin-Peter Mayer, Torsten … Materials Research Society
5 Conference Proceedings Evaluation of High Pressure Micro Jet Technology as an Alternative Pad Conditioning Method for Silicon Dioxide Chemical Mechanical Planarization Hyo-Sang Lee, Masano Sugiyama, Ara Philipossian, Yoshiyuki Seike, Mineo Takaoka American Institute of Chemical Engineers	11 Conference Proceedings Electrochemical Characterization of Copper in Ammonia-containing Slurries for Chemical Mechanical Planarization of Interconnects Sainio, C., Duquette, D.J. Electrochemical Society
6 Conference Proceedings Evaluation of High Pressure Micro Jet Technology as an Alternative Pad Conditioning Method for Silicon Dioxide Chemical Mechanical Planarization Hyo-Sang Lee, Masano Sugiyama, Ara Philipossian, Yoshiyuki Seike, Mineo Takaoka American Institute of Chemical Engineers	12 Conference Proceedings Electrochemical Aspects of Copper Chemical Mechanical Planarization (CMP) in Peroxide Based Slurry Ein-Eli, Y., Abelev, E., Starosvetsky, D. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12