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The Correlation of Adhesion Strength With Barrier Structure in Cu Metallization

Author(s):
Sekiguchi, A.
Koike, J.
Ueoka, K.
Ye, J.
Okamura, H.
Otsuka, N.
Ogawa, S.
Maruyama, K.
3 more
Publication title:
Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
766
Pub. Year:
2003
Page(from):
477
Page(to):
482
Pages:
6
Pub. info.:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558997035 [1558997032]
Language:
English
Call no.:
M23500/766
Type:
Conference Proceedings

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