Mechanical Properties of Organosilicon Thin Films Deposited from Cyclic and Acyclic Precursors Using Water as an Oxidant

Mechanical Properties of Organosilicon Thin Films Deposited from Cyclic and Acyclic Precursors Using Water as an Oxidant

Author(s):

Publication title:

Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

766

Pub. Year:

2003

Page(from):

273

Page(to):

278

Pages:

6

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997035 [1558997032]

Language:

English

Call no.:

M23500/766

Type:

Conference Proceedings

Details

TDL ID:	ZA00014424
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Conf. info. (Number):	2003
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2003.04.21-2003.04.25

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