Development of Porous SiLKTM Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes

Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

766

Pub. Year:

2003

Page(from):

265

Page(to):

272

Pages:

8

Pub. info.:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558997035 [1558997032]

Language:

English

Call no.:

M23500/766

Type:

Conference Proceedings

Details

TDL ID:	ZA00014424
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Conf. info. (Number):	2003
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2003.04.21-2003.04.25

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