The Texture Effect on Diffusion Barrier Property on TiN Films between Copper and Si Wafer

The Texture Effect on Diffusion Barrier Property on TiN Films between Copper and Si Wafer

Author(s):

Sung, D. Y.

Publication title:

Textures of materials : ICOTOM 14 : Proceedings of the 14th International Conference on Textures of Materials, held in Leuven, Belgium, July 11-15, 2005

Title of ser.:

Materials science forum

Ser. no.:

495-497(2)

Pub. Year:

2005

Page(from):

1371

Page(to):

1376

Pages:

6

Pub. info.:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499755 [087849975X]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00014249
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Textures of Materials : ICOTOM
Conf. info. (Number):	14th
Conf. info. (Venue):	Leuven, Belgium
Conf. info. (Date):	2005.07.11-2005.07.15

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