In Situ Observation of Thermal Stress in Nano-Size Thin Aluminum Films

In Situ Observation of Thermal Stress in Nano-Size Thin Aluminum Films

Author(s):

Publication title:

Residual stresses VII : ICRS 7 : proceedings of the 7th International Conference on Residual Stresses, ICRS-7 Xi'an, China, 14-17, June, 2004

Title of ser.:

Materials science forum

Ser. no.:

490-491

Pub. Year:

2005

Page(from):

577

Page(to):

582

Pages:

6

Pub. info.:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499694 [0878499695]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00014245
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Residual Stresses : ICRS
Conf. info. (Number):	7th
Conf. info. (Venue):	Xi'an, China
Conf. info. (Date):	2004.06.14-2004.06.17

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