Blank Cover Image

Study of Bonding of Grain Boundaries in Steels Using EELS

Author(s):
Publication title:
PRICM 5 : the Fifth Pacific Rim International Conference on Advanced Materials and Processing, November 2-5, 2004, Beijing, China
Title of ser.:
Materials science forum
Ser. no.:
475-479(5)
Pub. Year:
2005
Page(from):
4063
Page(to):
4066
Pages:
4
Pub. info.:
Uetikon-Zuerich: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499601 [0878499601]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

W. Chen, D. Ferguson, G.Y. Li, L.G. Ao, C.M. Wang, J. Zhang, H.X. Ma

Trans Tech Publications

M. Varela, V. Pena, Z. Sefrioui, J. Santamaria, S. Pennycook

Electrochemical Society

P. Yu, L. Zhang, L.X. Du, J. Hu

Trans Tech Publications

Ichinose, H., Zhang, Y., Ishida, Y., Ito, K., Nakanose, M.

MRS - Materials Research Society

Gulgun,M.A., Ching,W.Y., Ruhle,M.

Trans Tech Publications

L. Qi, X. Wu, Y. Wang

SPIE - The International Society of Optical Engineering

Yang, W. G., Zhang, L. N., Zhang, X., Hui, W. J.

Trans Tech Publications

M.X. Zhang, B. Yang, S.L. Wang, H.C. Wu

Trans Tech Publications

Y. Peng, H.J. Xiao, C.H. He, Z.L. Tian, C.Y. Ma, X.M. Zhang

Trans Tech Publications

Zhang, Y. D., Vincent, G., He, C. S., Zhao, X., Zuo, L., Esling, C.

Trans Tech Publications

Z. Gaál, P.J. Szabó, J. Ginsztler, L. Dévényi

Trans Tech Publications

Titchmarsh M. J., Vatter A. L.

Plenum Press

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12