Computer Simulation of Residual Stress Distribution and Microcracking due to Thermal Expansion Anisotropy

Computer Simulation of Residual Stress Distribution and Microcracking due to Thermal Expansion Anisotropy

Author(s):

Publication title:

ECRS 5 : proceedings of the Fifth European Conference on Residual Stresses : held September 28-30, 1999 in Delft-Noordwijkerhout, The Netherlands

Title of ser.:

Materials science forum

Ser. no.:

347-349

Pub. Year:

2000

Page(from):

211

Page(to):

216

Pages:

6

Pub. info.:

Zurich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878498550 [0878498559]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00014230
Series ID:	PA00000012
Conf. info. (Name):	ECRS : European Conference on Residual Stresses
Conf. info. (Number):	5th
Conf. info. (Venue):	Delft-Noordwijkerhout, The Netherlands
Conf. info. (Date):	1999.09.28-1999.09.30

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