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Interfacial Fluid Pressure and Its Effects on SiO2 Chemical Mechanical Polishing

Author(s):
Zhou, C.
Shan, L.
Hight, J.R.
Ng, S.H.
Paszkowski, A.J.
Tichy, J.
Danyluk, S.
2 more
Publication title:
Chemical mechanical polishing 2000 -- fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
613
Pub. Year:
2001
Page(from):
E7.1
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995215 [1558995218]
Language:
English
Call no.:
M23500/613
Type:
Conference Proceedings

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