Evolution Of Surface Morphology During Cu(TMVS)(hfac) Sourced Copper CVD
- Author(s):
- Publication title:
- Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 612
- Pub. Year:
- 2001
- Page(from):
- D9.16
- Pub. info.:
- Warrendale, PA: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558995208 [155899520X]
- Language:
- English
- Call no.:
- M23500/612
- Type:
- Conference Proceedings
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