Blank Cover Image

High Density Plasma Silicon Carbide As A Barrier/Etch Stop Film For Copper Damascene Interconnects

Author(s):
Publication title:
Materials, technology and reliability for advanced interconnects and low-k dielectrics : symposium held April 23-27, 2000, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
612
Pub. Year:
2001
Page(from):
D9.14
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558995208 [155899520X]
Language:
English
Call no.:
M23500/612
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Low Dielectric Constant Material Deposited by HDPCVD for Barrier and Etch Stop Application in Cu Damascene Structure

Cho, S.-M., Zhang, L., M'saad, H., Zhuang, L.

Electrochemical Society
7 Conference Proceedings Besoi using a Silicon Germanium Etch Stop

Li, X., Gay, D.L., McNeill, D.W., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
2 Conference Proceedings Reliability of Dielectric Barrier Films in Copper Damascene Applications

Lee, Albert S., Lakshmanan, Annamalai, Rajagopalan, Nagarajan, Cui, Zhenjiang, Le, Maggie, Xia, Li Qun, Kim, Bok Heon, …

Materials Research Society
8 Conference Proceedings A Novel Spin-Etch Planarization Process for Dual-Damascene Copper Interconnects

Levert, J., Mukherjee, S., DeBear, D., Fury, M.

Electrochemical Society
3 Conference Proceedings HDP-FSG Integration in Multilevel Interconnect Devices

M'saad, H., Vellaikal, M., Zhang, L., Witty, D.

MRS - Materials Research Society
9 Conference Proceedings Copper Electroplating for Damascene ULSI Interconnects

Dubin, V. M., Lopatin, S., Chen, S., Cheung, R., Ryu, C., Wong, S. S.

MRS - Materials Research Society
4 Conference Proceedings Challenges of damascene etching for copper interconnect

Ho,P.K.K., Zhou,M.-S., Gupta,S., Chockalingam,R., Li,J.-X., Fan,M.-H.

SPIE - The International Society for Optical Engineering
10 Conference Proceedings Etch Stop Phenomena in DPS High Density Etcher

Yang, M., Ambrose, T.

Electrochemical Society
5 Conference Proceedings PECVD Silicon Nitride For Damascene Applications

Lee, Albert, Rajagopalan, Nagarajan, Le, Maggie, Kim, Bok Heon, M’Saad, Hichem

Materials Research Society
11 Conference Proceedings Development and Characterization of a PECVD Silicon Nitride for Damascene Applications

Lee, A.S., Le, N.Rajagopalan.M., Kim, B.K., Saad, H.M.

Electrochemical Society
6 Conference Proceedings Simulation of Etch Stop in High Density Plasma Reactor

Yang, M., Gang, Y., Ambrose, Tom

Electrochemical Society
12 Conference Proceedings Electrical Properties of Organic and Silicon Carbide Etch Stop Layers in Copper/Porous MSQ Structures

G. C. Smith, R. McGowan, S. Hosali, L. Smith, K. Pfeifer

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12