Blank Cover Image

Role of Film Hardness on the Polish Rates of Metal Thin Films

Author(s):
Publication title:
Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
566
Pub. Year:
2000
Page(from):
123
Page(to):
128
Pages:
6
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558994737 [1558994734]
Language:
English
Call no.:
M23500/566
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Mechanism of Cu Removal During CMP in H2O2-Glycine Based Slurries

Babu, S. V., Hariharaputhiran, M., Li, Y., Ramarajan, S.

Materials Research Society
7 Conference Proceedings The Role of Metal and Passivation Defects in Electromigration-Induced Damage in Thin Film Conductors

Lloyd, J. R., Smith, P. M., Prokop, G. S.

North-Holland
2 Conference Proceedings Planarization of Cu and Ta Using Silica and Alumina Abrasives--- A Comparison

Li, Y., Ramarajan, S., Hariharapluhiran, M., Her, Y.S., Babu, S.V.

Materials Research Society
8 Conference Proceedings The Effects of Hardness Variation on Chemical Mechanical Polishing of Copper Thin Films

Joseph Bonivel, Yusuf Williams, Sarah Blitz, Micheal Kuo, Ashok Kumar

Materials Research Society
3 Conference Proceedings Role of Chemicals and Abrasive Particle Properties in Chemical-Mechanical Polishing of Copper and Tantalum

Li, Y., Jindal, A., Babu, S.V.

Electrochemical Society
9 Conference Proceedings Hardness of Thin Films Determined Based on Nanoindentation Load and Contact Stiffness

Stone, D. S., Tambwe, M. F., Kung, H., Nastasi, M.

MRS - Materials Research Society
4 Conference Proceedings Modified Preston Equation―Revisited

Babu, S. RamarajanS. V.

Materials Research Society
10 Conference Proceedings Characterization of Chemical-Mechanical Polishing of Inter-Metal Dielectric Film

S. Morimoto, R. Breivogel, R. Gasser, S. Louke, P. Moon, R. Patterson, M. Prince

Electrochemical Society
5 Conference Proceedings The Influence of pH and Temperature on Polish Rates and Selectivity of Silicon Dioxide and Nitride Films

America, W. G., Babu, S. V., Srinivasan, R.

Materials Research Society
11 Conference Proceedings Study on Chemical-Mechanical Polishing of Low Dielectric Constant Polyimide Thin Films

Tai, Y.L., Tsai, M.S., Tung, I.C., Dai, B.T., Feng, M.S.

Electrochemical Society
6 Conference Proceedings Effect of pH on Chemical-Mechanical Polishing of Copper and Tantalum

Jindal, Anurag, Li, Ying, Babu, S.V.

Materials Research Society
12 Conference Proceedings Modeling metal thin film growth under IPVD conditions using molecular dynamics rates in a level set approach

Hansen, U., Rodgers, S., Nemirovskaya, M., Jensen, K. F.

MRS-Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12