Blank Cover Image

Characterization of Slurry System and Suppression of Oxide Erosion in Aluminum CMP (Chemical-Mechanical Planarization)

Author(s):
Devriendt, ft.
Grilaert, J.
Heylen, N.
Holl, K.
Meuris, M.
Yang, J.
Zhong, L.
2 more
Publication title:
Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
566
Pub. Year:
2000
Page(from):
115
Page(to):
122
Pages:
8
Pub. info.:
Warrendale, PA: Materials Research Society
ISSN:
02729172
ISBN:
9781558994737 [1558994734]
Language:
English
Call no.:
M23500/566
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Modeling the Influence of Pad Bending on the Planarization Performance During CMP

Devriendt, K., Fyen, W., Grillaert, J., Heylen, N., Heyns, M., Meuris, M., Vrancken, E.

Materials Research Society
7 Conference Proceedings Electrochemical Aspects of Copper Chemical Mechanical Planarization (CMP) in Peroxide Based Slurry

Ein-Eli, Y., Abelev, E., Starosvetsky, D.

Electrochemical Society
2 Conference Proceedings Impact of Slurry Particle Aggregation upon Pad Surface Topography and Film Removal Rate in Chemical Mechanical Planarization

Zhong, L., Yang, J.

Electrochemical Society
8 Conference Proceedings Electrochemistry of Copper in the Chemical Mechanical Planarization (CMP) Slurries Containing Glycine and Hydrogen Peroxide

Aksu, S., Doyle, F.M.

Electrochemical Society
3 Conference Proceedings The Preparation of World-Class Single Crystal Silicon Carbide Wafers Using High Rate Chemical Mechanical Planarization Slurries

M.L. White, S. Reggie, N. Naguib, K. Nicholson, J. Gilliland

Trans Tech Publications
9 Conference Proceedings Characterization of Concentrated CMP Slurries by Acoustic Techniques

Carasso, M.L., Valdes, J.L., Psota-Kelty, L.A., Anthony, L.J.

Electrochemical Society
4 Conference Proceedings Influence of the Height Difference between the First and Second Nitride Layer on Erosion and Dishing in the Dual Nitride Approach for Shallow Trench Isolation

Heylen, N., Grillaert, J., Vrancken, E, Badenes, G., Rooyackers, R., Meuris, M., Heyns, M.

Electrochemical Society
10 Conference Proceedings Treatability of Chemical Mechanical Planarization (CMP) Wastewater

Brown, P.T., Davis, B.J., Sue, S.

Electrochemical Society
5 Conference Proceedings Electrochemical Characterization of Copper in Ammonia-containing Slurries for Chemical Mechanical Planarization of Interconnects

Sainio, C., Duquette, D.J.

Electrochemical Society
11 Conference Proceedings Electrochemical Characterization of Copper and Tantalum Chemical Mechanical Planarization

Liu, J., King, M., Darsillo, M., Baum, T.

Electrochemical Society
6 Conference Proceedings Chemical and Structural Characterization of Aluminum Oxide (Al2O3) Slurries

Lauwidjaja, M., Popescu, G., Richardson, K., Dogariu, A.

Electrochemical Society
12 Conference Proceedings Cavitation and Slurry Erosion of Aluminum in the Slurry Pot Tester

H.J. Amarendra, G.P. Chaudhari, S.K. Nath

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12