Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep
- Author(s):
Armbrust, D. Cohen, S. A. Gates, S. M. Gignac, L. Ivers, T. Liu, J. Rodbell, K. P. - Publication title:
- Low-dielectric constant materials V : symposium held April 5-8, 1999, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 565
- Pub. Year:
- 1999
- Page(from):
- 189
- Page(to):
- 196
- Pages:
- 8
- Pub. info.:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558994720 [1558994726]
- Language:
- English
- Call no.:
- M23500/565
- Type:
- Conference Proceedings
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