Selective Plating of Copper for Circuitization of Teflon and Epoxy-Based Substrates

Selective Plating of Copper for Circuitization of Teflon and Epoxy-Based Substrates

Author(s):

Publication title:

Proceedings of the Second Symposium on Electrochemically Deposited Thin Films

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

1994-31

Pub. Year:

1994

Page(from):

322

Page(to):

329

Pages:

8

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566770903 [1566770904]

Language:

English

Call no.:

E23400/950717

Type:

Conference Proceedings

Details

TDL ID:	ZA00014140
Series ID:	PA00000028
Conf. info. (Name):	Symposium on Electrochemically Deposited Thin Films ; Fall Meeting of the Electrochemical Society
Conf. info. (Number):	2nd ; 1994
Conf. info. (Venue):	Miami Beach, Florida, USA
Conf. info. (Date):	1994.10.09-1994.10.14

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