OXIDATION OF Cu-Sn and Ni-Sn INTERMETALLIC COMPOUNDS

OXIDATION OF Cu-Sn and Ni-Sn INTERMETALLIC COMPOUNDS

Author(s):

Publication title:

Proceedings of the Second International Symposium on Corrosion and Reliability of Electronic Materials and Devices

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

1993-1

Pub. Year:

1993

Page(from):

99

Page(to):

118

Pages:

20

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566770514 [1566770513]

Language:

English

Call no.:

E23400/930160

Type:

Conference Proceedings

Details

TDL ID:	ZA00014090
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Corrosion and Reliability of Electronic Materials and Devices
Conf. info. (Number):	2nd
Conf. info. (Venue):	Toronto, Ontario, Canada
Conf. info. (Date):	1992.10.11-1992.10.16

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