Stability of Shallow Junctions: Issue and Solution
- Author(s):
Shao, L. Thompson, P.E. Wang, X.M Chen, H. Liu, J.R. Chu, W.-K. - Publication title:
- Advanced short-time thermal processing for Si-based CMOS devices : proceedings of the international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2004-01
- Pub. Year:
- 2004
- Page(from):
- 82
- Page(to):
- 89
- Pages:
- 8
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566774062 [1566774063]
- Language:
- English
- Call no.:
- E23400/200401
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
7
Conference Proceedings
Thickness Effect On Nickel Silicide Formation And Thermal Stability For Ultra Shallow Junction CMOS
Materials Research Society |
2
Conference Proceedings
Ultra-Shallow Junction Formation Via Thermal diffusion of Boron into High Energy Ion Irradiated Silicon
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Materials Research Society |
4
Conference Proceedings
Stability of Ultra-Shallow Junctions Formed by 0.2 keV Boron Implantation and Spike Annealing
Electrochemical Society |
10
Conference Proceedings
Effect of Severe Plastic Deformation at Ambient Temperature on Microstructures and Mechanical Properties of Aluminum Alloy 2519
Trans Tech Publications |
Materials Research Society |
Kluwer Academic Publishers |
Electrochemical Society |
Materials Research Society |