Copper Electroplating: Effects on Chemical Mechanical planarization

Copper Electroplating: Effects on Chemical Mechanical planarization

Author(s):: Merricks, Davide
Publication title:: Chemical Mechanical Planarization : proceedings of the International Symposium
Title of ser.:: Electrochemical Society Proceedings Series
Ser. no.:: 2003-21
Pub. Year:: 2003
Page(from):: 343
Page(to):: 353
Pages:: 11
Pub. info.:: Pennington, NJ: Electrochemical Society
ISSN:: 01616374
ISBN:: 9781566774048 [1566774047]
Language:: English
Call no.:: E23400/200321
Type:: Conference Proceedings

Details

TDL ID:	ZA00014084
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	6th ; 204th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	2003.10.12-2003.10.17

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