Determining the Effects of Slurry Surfactant, Abrasive Size and Content on the Tribology and Kinetics of Copper CMP

Determining the Effects of Slurry Surfactant, Abrasive Size and Content on the Tribology and Kinetics of Copper CMP

Author(s):

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-21

Pub. Year:

2003

Page(from):

92

Page(to):

103

Pages:

12

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

Language:

English

Call no.:

E23400/200321

Type:

Conference Proceedings

Details

TDL ID:	ZA00014084
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	6th ; 204th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	2003.10.12-2003.10.17

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