Electrochemical Aspects of Copper Chemical Mechanical Planarization (CMP) in Peroxide Based Slurry

Electrochemical Aspects of Copper Chemical Mechanical Planarization (CMP) in Peroxide Based Slurry

Author(s):

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-21

Pub. Year:

2003

Page(from):

68

Page(to):

75

Pages:

8

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

Language:

English

Call no.:

E23400/200321

Type:

Conference Proceedings

Details

TDL ID:	ZA00014084
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	6th ; 204th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	2003.10.12-2003.10.17

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