Post-CMP Challenges for Cu-Low K Integration

Post-CMP Challenges for Cu-Low K Integration

Author(s):

Tamboli, D.

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-21

Pub. Year:

2003

Page(from):

10

Page(to):

18

Pages:

9

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774048 [1566774047]

Language:

English

Call no.:

E23400/200321

Type:

Conference Proceedings

Details

TDL ID:	ZA00014084
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	6th ; 204th
Conf. info. (Venue):	Orlando, FL, USA
Conf. info. (Date):	2003.10.12-2003.10.17

Similar Items:

1 Conference Proceedings Effect of Abrasive Particles on Chemical Mechanical Polishing Performance Tamboli, D., Banerjee, G., Chang, S., Waddell, M., Butcher, I., Arefeen, Q., Hymes, S. Electrochemical Society	7 Conference Proceedings Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal Hong, Y.K., Eom, D.H., Lee, S.H., Park, J.G., Busnaina, A.A. Electrochemical Society
2 Conference Proceedings Electrochemical Processes in Metal Planarization Technologies Tamboli, D., Chang, S., Evans, M., Butcher, I., Arefeen, Q., Waddell, M., Hymes, S. Electrochemical Society	8 Conference Proceedings Chemical Mechanical Cleaning for Post-CMP Applications: Defects and Metals Results Zhao, E. Y., Emami, R., Malik, I., Mishra, K., Krusell, W. C., Larios, J. de, Hymes, D. J. MRS - Materials Research Society
3 Conference Proceedings Abrasive Particle Effect on the Planarization of Cu Film Chang, S., Butch, I., Banerjee, G., Tamboli, D., Waddel, M., Hymes, S. Electrochemical Society	9 Conference Proceedings CORROSION PROTECTION OF COPPER IN POST-CMP PROCESSING TAMBOLI, DNYANESH, BANERJEE, GAUTAM, RAO, MADHUKAR, LANGAN, JOHN Electrochemical Society
4 Conference Proceedings STI Post CMP Cleaning Solution Development D. Tamboli, G. Banerjee, P. Subramanian, M.B. Rao Electrochemical Society	10 Conference Proceedings Integration Challenges of Inorganic Low-K (K < 2.5) Materials With Cu for Sub-0.25)μm Multilevel Interconnects Blumenthal, R., Braekelmann, G., Cave, N. G., Conner, J., Crabtree, P., Defilippi, J., Denning, D., Farkas, J., … Materials Research Society
5 Conference Proceedings Challenges of Post Cu CMP Cleaning (II) Li, Hugh, Zao, Eugene, Jiang, Linda, Hymes, Diane, Larios, John de Electrochemical Society	11 Conference Proceedings Determination of the Planarization Distance for Copper CMP Process Banet, M., Boning, D., Brown, T., Hymes, S., Joffe, M., Nguyen, J., Park, T., Smekalin, K., Ss, endW., Tugbawa, T., … Materials Research Society
6 Conference Proceedings Post Cu-CMP Engineering Challenges for the 65 nm Technology Nodes and Beyond S. Petitdidier, M. Mellier, D. Guiheux, M. Juhel Electrochemical Society	12 Conference Proceedings Integration Challenges of Inorganic Low-k (k ｡？2.5) Materials With Cu for Sub-0.25 ｦﾌm Multilevel Interconnects Yu, K. C., Defilippi, J., Tiwari, R., Sparks, T., Smith, D., Olivares, M., Selinidis, S., Zhang, J., Junker, K., … MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12