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Abrasive Particle Effect on the Planarization of Cu Film

Author(s):
Chang, S.
Butch, I.
Banerjee, G.
Tamboli, D.
Waddel, M.
Hymes, S.
1 more
Publication title:
Chemical Mechanical Planarization : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-21
Pub. Year:
2003
Page(from):
1
Page(to):
9
Pages:
9
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774048 [1566774047]
Language:
English
Call no.:
E23400/200321
Type:
Conference Proceedings

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